Step into the world of semiconductor manufacturing in this behind-the-scenes look at one of TI’s 300mm wafer fabs. 300mm wafer fabs are the most efficient high-volume wafer factories in the world.

TI is delivering geopolitically dependable supply. We operate 15 sites around the globe, including wafer fabs, assembly and test factories, and bump and probe facilities, in addition to strategically located product distribution centers.

Processed wafers are shipped from a TI wafer fab to one of their assembly and test sites, located around the world. Each wafer is packed with up to millions of semiconductor chips. At the A/T site, the individual chips are separated from the wafer, assembled, packaged and rigorously tested to ensure they meet quality and industry standards.

Today, billions of transistors can be designed on a single chip. The more densely packed the transistors, the smaller the process node required. Some manufacturing processes use nodes as small as 5 nanometers. Our recipes for 45nm-130nm process nodes are designed specifically for TI products – ensuring that we can offer higher performance, better power density, lower power, smaller size and more.

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