BASF, IBM Team Up In Chip Venture

Will develop electronic materials for use in manufacturing of integrated circuits

BASF, the world's leading chemicals maker, said on June 22 that it will join with IMB to develop electronic materials for use in the manufacturing of integrated circuits.

Under the agreement, BASF and IBM would develop chemical solutions for new high-performance, energy-efficient computer chips based on 32-nanometer technology, BASF said.

The technology, as well as related chemicals and materials, were expected to beused by major semi-conductor makers in North America, Asia and Europe "as early as 2010," the company said.

"The cooperation will benefit from IBMs leading semi-conductor process development and BASFs expertise and innovations in chemicals and nanotechnology," said Ralf Fink, senior manager at BASF Electronic Materials.

Copyright Agence France-Presse, 2007

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