Manufacturing Case Study: Using Telepresence For Long-Distance R&D

Jan. 24, 2008
Interoperable broadband meeting solutions make for seamless integration of far-flung collaborators.

Chipmaking heavyweight Qualcomm recently announced a trial telepresence program aimed at fostering deeper integration and increased communication between its San Diego headquarters and research facilities located in Campbell, Calif. and Bridgewater, N.J. The telepresence solution, which includes three installations of Teleris' VirtuaLive Modular, will be an addition to help engineers from the company's remote offices collaborate more effectively on research and design projects and ultimately improve productivity and efficiency.

"Research and development are cornerstones of Qualcomm's long history of technology innovation, and collaboration among our various remote locations has been an important part of our success." said Barbara Noerenberg, vice president of corporate R&D program management, Qualcomm.

According to the company, its VirtuaLive solution provides Qualcomm and many other global corporations with the latest telepresence technology and a broad set of room offerings that, together offer the most immersive and natural virtual meeting environment available on the market. By capturing and transmitting visual and auditory cues such as facial expressions, gestures and even side-comments, Teliris' technology faithfully replicates an in-person meeting experience. Teliris enables participants to collaborate as if they are working around the same table.

According to the company, its offerings can interoperate with telepresence systems from other vendors and connect remote users to telepresence meetings via a broadband Internet connection.

For further information regarding Teliris, visit the company's Web site at http://www.teliris.com or contact Teliris at [email protected].

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