International Electronics Manufacturing Initiative Opens China Office

Leaders focus on environmental legislation, miniaturization

More than 100 leaders from the electronics industry participated on Jan. 17 in the opening of the Shanghai office of the International Electronics Manufacturing Initiative (iNEMI), a worldwide industry-led consortium focused on advancing electronics manufacturing.

"China is an important and growing manufacturing hub in the global electronics industry, and we are making a concerted effort to increase our presence and consortial activities here in order to serve the needs of our members who are already running significant operations in this region, and also to help those fast-growing Chinese companies to become international players by providing well integrated global solutions" said Nasser Grayeli, vice president, Technology & Manufacturing of Intel Corp. and iNEMI Chairman who participated in the opening event.

Professor BI Keyun of the Chinese Electronic Packaging Society, and Huang Jianzhong from the Ministry of Information Industry of China, acted as officiating guests for the official ribbon-cutting.

Following the opening ceremony, leading experts discussed key industry issues during the "Innovation for the Electronics Industry" forum. Topics included environmental legislation in China and its implications, miniaturization and its future direction, and the quality and reliability of the global supply chain.

"We plan to use this momentum to develop a strong base of activity in the region. We are already defining and organizing regional deployment projects in Asia and expect to launch several during the first quarter of 2008," said ZHU Jian, director of PBA manufacturing for Alcatel Shanghai Bell and president of SMTA China.

Three technical subcommittees were formed, under which deployment activities will be organized. These are Manufacturing/Assembly Technologies, Component/Substrate Technologies and Materials Technologies. iNEMI's first regional deployment project, an initiative to address solder paste deposition issues, is currently being formed.

To view presentations from the event visit: http://www.inemi.org/cms/newsroom/Presentations/China_Forum_Jan08.html

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