Samsung Develops World's First Fusion Semiconductor

March 27, 2007
New technology can make handsets for mobile phone more compact.

The world's top memory chipmaker, Samsung Electronics, said March 27 it has developed the industry's first fusion semiconductor that combines two different types of flash memory. The Flex-OneNAND can help make handsets for mobile phones and multimedia gadgets much more compact at cheaper prices, Samsung officials said.

The product merges the two different NAND flash memory chips -- the SLC type which excels in processing data quickly and the MLC type suitable for storing large amounts of data -- into a single set, Samsung said. "The ratio of SLC to MLC functions within the same device can be freely adjusted in accordance with different product needs," spokeswoman Park Sunghae said.

Samsung said the fusion memory chip was unveiled at the Samsung Mobile Solution Forum in Taiwan on March 27.

Copyright Agence France-Presse, 2007

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