Samsung Develops World's First Fusion Semiconductor
The world's top memory chipmaker, Samsung Electronics, said March 27 it has developed the industry's first fusion semiconductor that combines two different types of flash memory. The Flex-OneNAND can help make handsets for mobile phones and multimedia gadgets much more compact at cheaper prices, Samsung officials said.
The product merges the two different NAND flash memory chips -- the SLC type which excels in processing data quickly and the MLC type suitable for storing large amounts of data -- into a single set, Samsung said. "The ratio of SLC to MLC functions within the same device can be freely adjusted in accordance with different product needs," spokeswoman Park Sunghae said.
Samsung said the fusion memory chip was unveiled at the Samsung Mobile Solution Forum in Taiwan on March 27.
Copyright Agence France-Presse, 2007
About the Author
Agence France-Presse
Copyright Agence France-Presse, 2002-2025. AFP text, photos, graphics and logos shall not be reproduced, published, broadcast, rewritten for broadcast or publication or redistributed directly or indirectly in any medium. AFP shall not be held liable for any delays, inaccuracies, errors or omissions in any AFP content, or for any actions taken in consequence.