The Taiwan Semiconductor Manufacturing Co. (TSM) said Nov. 8 it plans to build its third 12-inch wafer factory in Taiwan's Hsinchu Science Park, using the advanced 65-nanometer process technology.
TSMC, the world's largest contract chip maker as measured by revenue, will break ground in April according to Dow Jones Newswires.
The new plant will join two existing 12 in chip plants located at Hsinchu that have an annual capacity of 934,000 wafers.
Earlier this week the company approved a $1.13 billion budget to expand its capacity using both the 65-nanometer and 90-nanometer process technologies.
