Intel Reveals New Products And Technology

April 18, 2007
Company says innovations will go hand in hand with social networking.

Intel Corp. introduced more than 20 new products, technology innovations and industry initiatives -- many of them industry firsts -- aimed at making the World Wide Web, computers and consumer electronics devices much more responsive, friendlier and secure. The announcement was made April 17 at the Intel Developer Forum which was held in Beijing.

Intel disclosed new performance details for its next-generation "Penryn" processor family. The company also unveiled two product roadmaps for Intel architecture (IA)-based System on Chip (SOC) consumer electronic (CE) devices and business uses.

"Welcome to the era of multicore, an era in which all of our computing capabilities will multiply our own personal capabilities. This Beijing developer forum will show how our multiple innovations go hand in hand with evolutions in social networking, PC and TV entertainment, online commerce and other growing demands on the Internet. Today, Intel is delivering a breadth of multicore processors worldwide and a product roadmap providing the incredible performance boost and energy efficiency needed to put the consumer more in control of the information age," said Justin R. Rattner, Intel's chief technology officer.

Patrick P. Gelsinger, general manager, of the Digital Enterprise Group explained the benefits of the Penryn family of processors. For desktop PCs, he said to expect increases of about 15% for imaging-related applications; 25% for 3-D rendering; more than 40% for gaming; and more than 40% faster video encoding with Intel SSE4 optimized video encoders.

For high-performance computing (HPC) and workstation systems, Gelsinger said to expect gains up to an estimated 45% for bandwidth intensive applications; and a 25% increase for servers using Java1.

Gelsinger unveiled "Tolapai" plans, the first in what will be a family of enterprise-class "system-on-chip" (SoC) products that integrate several key system components into a single Intel architecture-based processor. The 2008 Tolapai product is expected to reduce the chip sizes by up to 45% and power consumption by approximately 20% compared to a standard four-chip design2, while improving throughput performance and processor efficiency. Tolapai will include the new Intel QuickAssist Integrated Accelerator technology.

Also at IDF, Eric Kim, general manager of Intel's Digital Home Group, said Intel is focused on developing products and technologies that provide consumers with greater control, choice, clarity and community -- the "4C's" -- across computers and CE platforms spanning PCs, laptops, televisions, set-top-boxes and other networked media players.

Justin R. Rattner, Intel's chief technology officer Rattner reiterated the company's goals for processor performance and energy efficiency noting that Intel will be able to drive down power consumption by a factor of 10 for the ultra mobile computing segment by 2010. Intel will also create future processors at Teraflops speeds, and Rattner urged the industry to work together to take advantage of this raw processing power. The next stage of Intel's tera-scale research will be around "stacked" memory on top of the 80-core research chip Intel demonstrated earlier this year.

For more information visit the Intel Development Forum.

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