Updated: Amkor Technology to Spend $2 Billion on Arizona Chip Packaging & Testing Site

Nov. 30, 2023
The latest chip fabrication news and a slideshow offering a comprehensive look at the billions for new semiconductor production capacity in the U.S.

Editor's note: This slideshow originally ran on Nov. 10, 2022, providing a bird's-eye view of the major semiconductor fabrication projects announced in the past 18 months. It has now been updated seven times:

  • November 30, 2023—Amkor Technology announces it will spend $$2 billion on semiconductor packaging and testing facility in Arizona.
  • May 22, 2023—Applied Materials to spend $4 billion on R&D facilities in California.
  • March 16, 2023—Texas Instruments announces it will build a new fab in Lehi, Utah.
  • February 13, 2023—Pallidus announces it will move its operations to South Carolina.
  • January 23, 2023—Intel releases a progress report on construction of its Ohio plant.
  • December 20, 2022—Entegris decides to invest $600 million in its Colorado operations.
  • December 6, 2022—TSMC confirms it will add a second fabricator to its planned Arizona campus.

This slideshow has been updated to reflect the latest news, and we will likely continue updating this story in the future as companies announce major investments. 

Both before and after the August 2022 passage of the CHIPs Act providing federal support, the U.S. has seen a spree of announcements by tech companies promising to build up domestic chip production. The acute chip shortage suffered during the Covid-19 pandemic and the chronic shortages caused by ensuing supply chain issues has given rise to a newly burgeoning landscape in semiconductor, computer electronics, and related supply factory announcements.

This slideshow aims to provide a birds-eye view of all the newest announcements with implications for the future of computer electronics manufacturing in the United States, in addition to a closer look at the most recent semiconductor news.

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