Intel Corp. announced May 3 that it will invest $3.5 billion at its Rio Rancho site in New Mexico to manufacture advanced semiconductor packaging technologies, including Foveros, its 3D packaging technology.
The multiyear investment is expected to create at least 700 high-tech jobs and 1,000 construction jobs, the Santa Clara, California-based technology company said during a news conference. Construction is expected to begin in late 2021.
This news comes little more than a month after Intel announced plans to build two new semiconductor factories in Chandler, Arizona, at a cost of $20 billion, and the formation of a standalone semiconductor manufacturing business, Intel Foundry Services.
Intel’s New Mexico operations employ more than 1,800 people.
Above photo is an aerial view of the Rio Rancho site.
